However, mechanical flexibility is often accompanied by physical stress. In demanding applications, the flexible modules must reliably withstand the load in the respective application. For this challenge, LUMITRONIX ® last one innovative production process established to make flexible electronics more robust for challenging applications.
Features of the unique technology
- Structured or smooth surfaces possible
- High dielectric strength
- High material transparency
- Hardly any color shifts
- Different designs and colors with optional textile layers possible
- Different connection and sealing options with cables, plugs, eyelets & crimp contacts
The Lamination Process
In the new production plant, both flat and line-shaped electronic assemblies are laminated with several polymer materials. Depending on the application, the material composition can be adjusted. The lamination process uses heat and pressure to apply multiple layers of plastic to the front and back of the flexible circuit board material.
The components assembled on the flexible circuit board are encapsulated in this process, whereby any air residues in the composite material are excluded. Since only very thin layers are used, the flexibility of the module is retained and at the same time the mechanical resistance increases significantly. The high transparency of the materials used makes the innovative technology a perfect addition to assemblies with LEDs or optical sensors.
With LumProtect® flexible LED modules remain safely protected
The innovative lamination technology offers reliable protection against a wide variety of environmental influences. Whether solar radiation, wind or water - the modules withstand any weather and can therefore be used outdoors for flexible lighting solutions, for example. Furthermore, the lamination protects the Flex module against various chemicals in the air (e.g. exhaust fumes) or in direct contact with the surface (e.g. paint, cleaning agents, dust). Mechanical stress, such as direct intervention in the electronics by the user, can also be largely avoided. Despite the lamination, the flexibility of the assembly is retained, so that multi-dimensional installations remain possible.
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